Vacuum insulation panels (VIP) and atmospheric-pressure microporous insulation board are two very different products built on the same underlying chemistry. The fumed-silica microporous core is the same — what differs is whether the envelope is sealed under vacuum or exposed to atmospheric pressure. The performance gap is roughly 5×; the lifetime, cost, and use-case profile differ as well. This article helps specify the right one.
VIP: Vacuum-Sealed Microporous Core
A vacuum insulation panel is a sealed envelope (high-barrier multi-layer laminate film or aluminium-foil laminate) containing a pressed microporous core at ~ 1 mbar absolute pressure. Under vacuum the gas-phase conduction through the pores is suppressed almost entirely — there are not enough gas molecules to transport heat. The remaining conduction paths are solid conduction through the core matrix and radiation across the panel.
The result is a centre-of-panel thermal conductivity of 0.004 W/(m·K) at 25 °C — about five times lower than our atmospheric-pressure microporous board (0.020 W/(m·K)) at the same temperature. VIP delivers about 5–8 R-value per inch of thickness. The trade-off is service life: the vacuum degrades over decades as the envelope is slowly permeated by atmospheric gases; typical VIP service-life targets are 25 years for building applications and 10–15 years for cold-chain transport.
Microporous Board: Atmospheric Pressure, Rigid
Atmospheric-pressure microporous board exposes the same fumed-silica core to ambient air. The Knudsen-effect suppression of gas conduction still works (because pore size is smaller than the mean free path of air), but it is less complete than in vacuum. Thermal conductivity lands at 0.020 W/(m·K) at 25 °C. There is no vacuum envelope to fail, so service life is in decades without measurable performance loss as long as the board stays dry and mechanically supported.
Side-by-Side Comparison
- Thermal conductivity @ 25 °C — VIP 0.004 W/(m·K) vs board 0.020 W/(m·K)
- R-value per 25 mm — VIP ≈ 35, board ≈ 7
- Maximum service temperature — VIP 80 °C (typical), board 1000 °C
- Service life — VIP 10–25 years (envelope-limited), board 25+ years (no envelope)
- Cost per m² at 25 mm — VIP ≈ 5–10× board
- Mechanical robustness — VIP cannot be cut or drilled on site without ruining the vacuum; board can be cut and drilled with standard tools
- Form factor — VIP sealed panel from ~ 200 × 200 mm up to ~ 1 200 × 800 mm; board 1 000 × 615 mm; both available as custom sized
When VIP Is the Right Specification
VIP is the right specification where thermal performance per millimetre is the binding constraint and the envelope can be protected from puncture and UV. Typical applications: pharmaceutical cold-chain transport boxes, blood-plasma freezers, ultra-low-temperature freezers, cryogenic vessel shields (LNG), aerospace thermal-protective panels. VIP is also specified for residential refrigerator and freezer walls where reducing wall thickness by 30 mm adds meaningful interior volume.
See our VIP panels product page for sizes, R-values, and envelope options.
When Atmospheric Board Is the Right Specification
Atmospheric microporous board is the right specification wherever VIP fails: high-temperature service (above ~ 80 °C), any installation where the board may need to be cut or drilled on site, mechanical shock or vibration, environments where envelope puncture is plausible. Industrial furnace backup, ladle insulation, kiln lining, petrochemical vessel insulation, aerospace non-cryogenic panels — all of these favour atmospheric board.
For lower-temperature cold-chain service where VIP is overkill, our PE-Faced Nano Microporous Insulation Board gives food-grade, washable, non-vacuum cold performance at a much lower cost than VIP.
Common Misconceptions
- Misconception: “VIP is just better insulation.” Reality: VIP is five times better per millimetre but only at low temperatures and only when the envelope is intact. For 1000 °C furnace backup, VIP is not an option at all.
- Misconception: “VIP cannot fail.” Reality: VIP degrades as the envelope is permeated. Lifetime depends on envelope material and on minimising exposure to UV, mechanical shock, and high temperatures.
- Misconception: “Microporous board needs VIP to hit the lowest thermal conductivity.” Reality: Atmospheric microporous board at 25 °C is 0.020 W/(m·K), which is the same order as still-air insulation. The combination of fumed silica + opacifier + 10–30 nm pore delivers the best per-millimetre performance of any non-vacuum rigid insulation.
- Misconception: “VIP is expensive at any thickness.” Reality: VIP cost is roughly proportional to envelope area, not to thickness; doubling thickness adds only 50–80 % cost. Atmospheric board cost is roughly proportional to thickness.
Specifying the right one
Request a Quote — VIP vs. Microporous Board Sizing
Hybrid Configurations: VIP + Microporous Board
Some installations benefit from combining VIP and atmospheric microporous board. The VIP takes the high-performance duty where envelope area is limited; the atmospheric board carries the structural and high-temperature duty. Two common hybrid configurations:
- VIP-cored cold-chain panels: a 25 mm VIP core sandwiched between two 5 mm layers of microporous board achieves a panel R-value of approximately 50 with mechanical robustness that bare VIP cannot match.
- VIP + board furnace cold-face shields: where the cold-face of a high-temperature furnace must stay below 50 °C for worker safety, a 50 mm microporous board layer plus a 25 mm VIP cold-face shield reaches cold-face temperatures 15–20 °C lower than microporous board alone.
Hybrid configurations are custom-engineered per application. Speak to our engineering team about specifying one for your application — see our hybrid VIP-and-board design request form for a quotation package.
Reading Datasheet Numbers Correctly
VIP and microporous board datasheets publish thermal-conductivity numbers with subtly different conventions. VIP datasheets typically publish the centre-of-panel value (0.004 W/(m·K) at 25 °C) measured in the middle of the panel — but the edge-of-panel value (within 25 mm of the envelope seal) is 2–4× higher because of the thermal bridge through the envelope. Microporous board datasheets publish an average value across the panel and do not have an edge penalty. When comparing the two, multiply the VIP centre value by approximately 1.3 to estimate the effective whole-panel R-value for whole-panel designs.
Procurement & Logistics: Practical Considerations
VIP and atmospheric microporous board differ in how they are procured. VIP is typically a custom-built product to specific envelope dimensions; lead times for custom sizes are 4–8 weeks depending on size and quantity. Microporous board is typically a stocked product in standard sizes (1000 × 615 mm, thicknesses 10–50 mm); lead times for standard configurations are 1–3 weeks from order to shipment. For projects with tight procurement windows, atmospheric board is the more responsive specification.
VIP also imposes storage and handling constraints: the vacuum envelope is vulnerable to puncture during transport and installation, and the panels must be kept at a reasonable temperature range (typically −40 °C to +60 °C) before installation. Atmospheric microporous board has no such constraints — vacuum-sealed in PE film for transport, but otherwise indifferent to storage temperature and humidity within normal industrial ranges.
Recap: Choosing the Right Microporous Configuration
The decision framework is straightforward: any installation above ~80 °C and below vacuum-pressure cost premium should be atmospheric microporous board. Applications that are temperature-limited and envelope-limited — pharmaceutical cold-chain transport, residential refrigeration, cryogenic vessel shields — are VIP territory. Hybrid configurations combine the best of both but require custom engineering. Whatever the specification, the underlying fumed-silica microporous chemistry is the same; only the envelope and the operational pressure change. Speak to our engineering team for a sizing and configuration recommendation for your application.